Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-A3P1000-2FGG256 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | Copper Wire Rev. C 24/Jun/2013 | |
| Standard Package | 90 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | ProASIC3 | |
| Number of LABs/CLBs | - | |
| Number of Logic Elements/Cells | - | |
| Total RAM Bits | 147456 | |
| Number of I/O | 177 | |
| Number of Gates | 1000000 | |
| Voltage - Supply | 1.425 V ~ 1.575 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | 0°C ~ 70°C | |
| Package / Case | 256-LBGA | |
| Supplier Device Package | 256-FPBGA (17x17) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | A3P1000-2FGG256 | |
| Related Links | A3P1000, A3P1000-2FGG256 Datasheet, Microsemi SoC Distributor | |
![]() | PM3604-20-B | INDUCT ARRAY 2 COIL 20UH SMD | datasheet.pdf | |
![]() | NC7SZ08L6X | IC GATE AND 1CH 2-INP 6-MICROPAK | datasheet.pdf | |
![]() | LTC2637HMS-LZ12#PBF | IC DAC 12BIT I2C OCTAL 16MSOP | datasheet.pdf | |
![]() | MCR50JZHF2551 | RES SMD 2.55K OHM 1% 1/2W 2010 | datasheet.pdf | |
![]() | TNPU0805357RAZEN00 | RES SMD 357 OHM 0.05% 1/8W 0805 | datasheet.pdf | |
![]() | RNC50J3401FSRE6 | RES 3.4K OHM 1/10W 1% AXIAL | datasheet.pdf | |
![]() | RN55E2320DBSL | RES 232 OHM 1/8W .5% AXIAL | datasheet.pdf | |
![]() | B43231B477M | CAP ALUM 470UF 20% 315V SNAP | datasheet.pdf | |
![]() | 82340-1675 | TRIM KIT FOR 24X54 MAT. RAMP TRI | datasheet.pdf | |
![]() | 92418-415HLF | HEADER BERGSTIK | datasheet.pdf | |
![]() | PC02C-8-4P | CONN RCPT 4POS BOX MNT PIN | datasheet.pdf | |
![]() | 0347811001 | MX150 BLD TERM TIN 1416 AWG D WI | datasheet.pdf |