Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-A3P1000-2FGG256I | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | Copper Wire Rev. C 24/Jun/2013 | |
| Standard Package | 90 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | ProASIC3 | |
| Number of LABs/CLBs | - | |
| Number of Logic Elements/Cells | - | |
| Total RAM Bits | 147456 | |
| Number of I/O | 177 | |
| Number of Gates | 1000000 | |
| Voltage - Supply | 1.425 V ~ 1.575 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | -40°C ~ 100°C | |
| Package / Case | 256-LBGA | |
| Supplier Device Package | 256-FPBGA (17x17) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | A3P1000-2FGG256I | |
| Related Links | A3P1000-, A3P1000-2FGG256I Datasheet, Microsemi SoC Distributor | |
![]() | AT27C1024-90JC | IC OTP 1MBIT 90NS 44PLCC | datasheet.pdf | |
![]() | 961258-5900-AR-TP | CONN HEADER R/A 58POS GOLD SMD | datasheet.pdf | |
![]() | 0639001500 | FINE ADJUST APPLICATOR | datasheet.pdf | |
![]() | CDR31BP110BJZSAT | CAP CER 11PF 100V 5% BP 0805 | datasheet.pdf | |
![]() | CDR35BP123AKZSAT | CAP CER 0.012UF 50V 10% BP 1825 | datasheet.pdf | |
![]() | RWR81S2R80FSB12 | RES 2.8 OHM 1W 1% WW AXIAL | datasheet.pdf | |
![]() | RN50C76R8FB14 | RES 76.8 OHM 1/20W 1% AXIAL | datasheet.pdf | |
![]() | 7201P3Y1V3QE | SWITCH TOGGLE DPDT 5A 120V | datasheet.pdf | |
![]() | 370-10-118-00-001101 | HEADER TURRET SOLDER TAIL 2.54MM | datasheet.pdf | |
![]() | SI3056SSI-EB | BOARD EVAL SI3056/SI3018 | datasheet.pdf | |
![]() | GCB55DYFN | CONN EDGECARD .050" 55POS SMD | datasheet.pdf | |
![]() | ATS-13C-111-C3-R1 | HEATSINK 60X40X9.5MM XCUT T412 | datasheet.pdf |