Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-A3P1000-FGG256T | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 90 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | ProASIC3 | |
| Number of LABs/CLBs | - | |
| Number of Logic Elements/Cells | - | |
| Total RAM Bits | 147456 | |
| Number of I/O | 177 | |
| Number of Gates | 1000000 | |
| Voltage - Supply | 1.425 V ~ 1.575 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | -40°C ~ 125°C | |
| Package / Case | 256-LBGA | |
| Supplier Device Package | 256-FPBGA (17x17) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | A3P1000-FGG256T | |
| Related Links | A3P1000, A3P1000-FGG256T Datasheet, Microsemi SoC Distributor | |
![]() | 4606X-102-564 | RES ARRAY 3 RES 560K OHM 6SIP | datasheet.pdf | |
![]() | HC2E-HP-DC36V | RELAY GEN PURPOSE DPDT 3A 36V | datasheet.pdf | |
![]() | NKE0505SC | CONV DC/DC 1W 5VIN 5VOUT SIP SGL | datasheet.pdf | |
![]() | SA102C331JAR | CAP CER 330PF 200V X7R AXIAL | datasheet.pdf | |
![]() | TB-75.000MBE-T | OSC MEMS 75.000MHZ CMOS SMD | datasheet.pdf | |
![]() | 310000500047 | HERMETIC THERMOSTAT | datasheet.pdf | |
![]() | JG-72973 | TOGGLE SW HDW | datasheet.pdf | |
![]() | 10NSEV10M4X5.5 | CAP ALUM 10UF 20% 10V SMD | datasheet.pdf | |
![]() | TFPT0805L1201FZ | THERMISTOR PTC 1.2K OHM 1% 0805 | datasheet.pdf | |
![]() | 1782R-77J | FIXED IND 240UH 47MA 25 OHM TH | datasheet.pdf | |
| UPS1V4R7MDD1TD | CAP ALUM 4.7UF 20% 35V RADIAL | datasheet.pdf | ||
![]() | ATS-13F-71-C3-R0 | HEATSINK 45X45X30MM L-TAB T412 | datasheet.pdf |