Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-A3P125-1FGG144 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | Copper Wire Rev. C 24/Jun/2013 | |
| Standard Package | 160 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | ProASIC3 | |
| Number of LABs/CLBs | - | |
| Number of Logic Elements/Cells | - | |
| Total RAM Bits | 36864 | |
| Number of I/O | 97 | |
| Number of Gates | 125000 | |
| Voltage - Supply | 1.425 V ~ 1.575 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | 0°C ~ 70°C | |
| Package / Case | 144-LBGA | |
| Supplier Device Package | 144-FPBGA (13x13) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | A3P125-1FGG144 | |
| Related Links | A3P125-, A3P125-1FGG144 Datasheet, Microsemi SoC Distributor | |
![]() | T491A106K006AS | CAP TANT 10UF 6.3V 10% 1206 | datasheet.pdf | |
![]() | RT0603DRE0725K5L | RES SMD 25.5KOHM 0.5% 1/10W 0603 | datasheet.pdf | |
![]() | RCC08DRTN-S734 | CONN EDGECARD 16POS DIP .100 SLD | datasheet.pdf | |
![]() | ABM36DTAN-S664 | CONN EDGECARD 72POS R/A .156 SLD | datasheet.pdf | |
![]() | TNPW2512732KBETG | RES SMD 732K OHM 0.1% 1/2W 2512 | datasheet.pdf | |
![]() | IDT74LVC16344APVG8 | IC CLK BUFFER 2:4 56-SSOP | datasheet.pdf | |
![]() | 1-282862-0 | TERM BLOCK RCPT WIRE 10POS R/A | datasheet.pdf | |
![]() | TVX2C221MDD | CAP ALUM 220UF 20% 160V AXIAL | datasheet.pdf | |
![]() | U21T2PCLE | SWITCH TOGGLE DPDT 5A 120V | datasheet.pdf | |
![]() | C2012X7R0J685K125AB | CAP CER 6.8UF 6.3V X7R 0805 | datasheet.pdf | |
![]() | AS7C1026C-15JINTR | IC SRAM 1M 64X16 44-SOJ | datasheet.pdf | |
![]() | MPC8547ECVJAQGD | IC MPU MPC85XX 1.0GHZ 783FCBGA | datasheet.pdf |