Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-A3P250-2FG256I | |
Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
PCN Design/Specification | Copper Wire Rev. C 24/Jun/2013 | |
Standard Package | 90 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - FPGAs (Field Programmable Gate Array) | |
Series | ProASIC3 | |
Number of LABs/CLBs | - | |
Number of Logic Elements/Cells | - | |
Total RAM Bits | 36864 | |
Number of I/O | 157 | |
Number of Gates | 250000 | |
Voltage - Supply | 1.425 V ~ 1.575 V | |
Mounting Type | Surface Mount | |
Operating Temperature | -40°C ~ 100°C | |
Package / Case | 256-LBGA | |
Supplier Device Package | 256-FPBGA (17x17) | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | A3P250-2FG256I | |
Related Links | A3P250-, A3P250-2FG256I Datasheet, Microsemi SoC Distributor |
![]() | DF11Z-12DS-2V(20) | Connector Receptacle 12 Position 0.079" (2.00mm) Tin Surface Mount | datasheet.pdf | |
![]() | TC1301B-GDDVMFTR | IC REG LDO 2.7V/3V/2.5V 8DFN | datasheet.pdf | |
![]() | RG3216N-1871-P-T1 | RES SMD 1.87KOHM 0.02% 1/4W 1206 | datasheet.pdf | |
![]() | GSC28DRTN | CONN EDGECARD 56POS DIP .100 SLD | datasheet.pdf | |
![]() | KR-5R5V474-R | CAP 470MF -20% +80% 5.5V T/H | datasheet.pdf | |
5.46.001.106/0200 | PLUNGER 6MM DIA WHITE | datasheet.pdf | ||
![]() | EBA10DCKI-S288 | CONN EDGECARD 20POS .125" | datasheet.pdf | |
![]() | YK51520330J0G | Connector Barrier Block Strip 20 Circuit 0.374" (9.50mm) | datasheet.pdf | |
![]() | 623A | HEATSINK FOR TO3 | datasheet.pdf | |
![]() | 209-3LPSTF | DIP SWITCH | datasheet.pdf | |
![]() | 55A0114-26-4CS1889 | CABLE STRANDED | datasheet.pdf | |
![]() | BACC63BP20C39S10H | 26500 37#20 2#16 S TH PLUG LC | datasheet.pdf |