Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-A3P250-2FGG144I | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | Copper Wire Rev. C 24/Jun/2013 | |
| Standard Package | 160 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | ProASIC3 | |
| Number of LABs/CLBs | - | |
| Number of Logic Elements/Cells | - | |
| Total RAM Bits | 36864 | |
| Number of I/O | 97 | |
| Number of Gates | 250000 | |
| Voltage - Supply | 1.425 V ~ 1.575 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | -40°C ~ 100°C | |
| Package / Case | 144-LBGA | |
| Supplier Device Package | 144-FPBGA (13x13) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | A3P250-2FGG144I | |
| Related Links | A3P250-, A3P250-2FGG144I Datasheet, Microsemi SoC Distributor | |
![]() | BBL-114-G-E | CONN HEADR LOPRO 14POS .100 GOLD | datasheet.pdf | |
![]() | ESM36DRSD-S664 | CONN EDGECARD 72POS DIP .156 SLD | datasheet.pdf | |
![]() | LT3009EDC-1.5#TRMPBF | IC REG LDO 1.5V 20MA 6DFN | datasheet.pdf | |
![]() | PGA870IRHDR | IC OPAMP PGA 650MHZ 28VQFN | datasheet.pdf | |
| 3045318 | TERM BLOCK PLUG 1POS 90DEG | datasheet.pdf | ||
![]() | LFSC3GA115E-5FF1704I | IC FPGA 942 I/O 1704BGA | datasheet.pdf | |
![]() | 28044 | LASER RANGE FINDER MODULE | datasheet.pdf | |
![]() | RN70D3011FRSL | RES 3.01K OHM 3/4W 1% AXIAL | datasheet.pdf | |
![]() | RER40F2R99RC02 | RES CHAS MNT 2.99 OHM 1% 5W | datasheet.pdf | |
![]() | RPP30-2412S-L | 30W DC/DC-CONV POWERLINE-PLUS | datasheet.pdf | |
![]() | UPT17R/TR13 | TVS DIODE 17VWM POWERMITE | datasheet.pdf | |
![]() | 672D108H012DS2C | 1000UF 12V 12.5X42.5 105C RAD | datasheet.pdf |