Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-A3P250-FGG144 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | Copper Wire Rev. C 24/Jun/2013 | |
| Standard Package | 160 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | ProASIC3 | |
| Number of LABs/CLBs | - | |
| Number of Logic Elements/Cells | - | |
| Total RAM Bits | 36864 | |
| Number of I/O | 97 | |
| Number of Gates | 250000 | |
| Voltage - Supply | 1.425 V ~ 1.575 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | 0°C ~ 70°C | |
| Package / Case | 144-LBGA | |
| Supplier Device Package | 144-FPBGA (13x13) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | A3P250-FGG144 | |
| Related Links | A3P250, A3P250-FGG144 Datasheet, Microsemi SoC Distributor | |
![]() | H4BXG-10108-S6 | JUMPER-H9991TR/1853 SL/X 8" | datasheet.pdf | |
![]() | GSA31DTBT | CONN EDGECARD 62POS R/A .125 SLD | datasheet.pdf | |
![]() | 73305-112LF | CONN MOD JACK 6P4C R/A UNSHLD | datasheet.pdf | |
![]() | AIUR-11-471K | FIXED IND 470UH 490MA 816 MOHM | datasheet.pdf | |
![]() | 9DB233AFLF | IC CLK FANOUT/BUFF ZD 20QSOP | datasheet.pdf | |
![]() | IHSM4825PJ2R2L | FIXED IND 2.2UH 5.7A 29 MOHM SMD | datasheet.pdf | |
![]() | ECW-H12512RHV | CAP FILM 5100PF 3% 1.25KVDC RAD | datasheet.pdf | |
![]() | TPS43340QPHPRQ1 | IC REG QD BCK/LINEAR 48HTQFP | datasheet.pdf | |
![]() | MS27466T25F61H-LC | CONN HSG RCPT FLANGE 61POS PIN | datasheet.pdf | |
![]() | OA180AN-22-1WB1856 | FAN AXIAL 176X89MM 230VAC WIRE | datasheet.pdf | |
![]() | DG441BDJ | IC SWITCH QUAD SPST 16DIP | datasheet.pdf | |
![]() | 782423700 | EMI SUPPRESSION FERRITE BEAD SMD | datasheet.pdf |