Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-A3P250-VQ100T | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 90 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | ProASIC3 | |
| Number of LABs/CLBs | - | |
| Number of Logic Elements/Cells | - | |
| Total RAM Bits | 36864 | |
| Number of I/O | 68 | |
| Number of Gates | 250000 | |
| Voltage - Supply | 1.425 V ~ 1.575 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | -40°C ~ 125°C | |
| Package / Case | 100-TQFP | |
| Supplier Device Package | 100-VQFP (14x14) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | A3P250-VQ100T | |
| Related Links | A3P250, A3P250-VQ100T Datasheet, Microsemi SoC Distributor | |
![]() | 450D252KSD8 | POT 2.5K OHM 1/2W CARBON LINEAR | datasheet.pdf | |
![]() | 9T08052A5602CAHFT | RES SMD 56K OHM 0.25% 1/8W 0805 | datasheet.pdf | |
![]() | MAX8581ETB+T | IC CONV 2.5MHZ CDMA 10-TDFN | datasheet.pdf | |
![]() | MAX4621CSE+T | IC SWITCH DUAL SPST 16SOIC | datasheet.pdf | |
![]() | RLR07C3903GMBSL | RES 390K OHM 2% 1/4W AXIAL | datasheet.pdf | |
![]() | 322-87-160-41-001101 | Connector Socket 60 Position 0.100" (2.54mm) Gold Through Hole | datasheet.pdf | |
![]() | XPEBBL-L1-R250-00Y03 | EE XP-E BLUE | datasheet.pdf | |
![]() | 78286-106HLF | HEADER BERGSTIK | datasheet.pdf | |
![]() | 98417-G61-26LF | CONN HEADER STRT | datasheet.pdf | |
![]() | ECC50DKUS | CONN EDGECARD 100POS .100" | datasheet.pdf | |
![]() | C13723_MIRELLA-RZL | LENS RND 1POS 41MM 2.45MM HT | datasheet.pdf | |
![]() | D-500-L455-2-613-078 | IN LINE COUPLERS | datasheet.pdf |