Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-A3P600-FGG484I | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | Gold to Palladium Coated Copper Wire Chg 5/Nov/2015 | |
| Standard Package | 40 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | ProASIC3 | |
| Number of LABs/CLBs | - | |
| Number of Logic Elements/Cells | - | |
| Total RAM Bits | 110592 | |
| Number of I/O | 235 | |
| Number of Gates | 600000 | |
| Voltage - Supply | 1.425 V ~ 1.575 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | -40°C ~ 100°C | |
| Package / Case | 484-BGA | |
| Supplier Device Package | 484-FPBGA (23x23) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | A3P600-FGG484I | |
| Related Links | A3P600-, A3P600-FGG484I Datasheet, Microsemi SoC Distributor | |
![]() | EDSTL976/6 | TERM BLOCK HDR 12POS VERT 5MM | datasheet.pdf | |
![]() | HST0.8-9-X2 | HEAT SHRINK THICK ADH RED.8X9" | datasheet.pdf | |
![]() | ADD8504WRUZ | IC GAMMA BUFFER 4CHAN 16-TSSOP | datasheet.pdf | |
![]() | GEM28DRTI-S13 | CONN EDGECARD 56POS .156 EXTEND | datasheet.pdf | |
![]() | 1-206455-1 | CONN RCPT CPC 63POS PANEL MOUNT | datasheet.pdf | |
![]() | 150393K630EC | CAP FILM 0.039UF 630VDC AXIAL | datasheet.pdf | |
![]() | VE-B11-IV-B1 | CONVERTER MOD DC/DC 12V 150W | datasheet.pdf | |
![]() | B41827B4477M | CAP ALUM 470UF 20% RADIAL | datasheet.pdf | |
![]() | F65312103 | POS TRANS-XDCR LFW 12IN 5K/0.1% | datasheet.pdf | |
![]() | 36-012-171 | CABLE 36POS .100 JUMPER 12 INCH | datasheet.pdf | |
![]() | 8SLVD1208NBGI8 | IC CLK BUFFER 2:8 2GHZ 28VFQFN | datasheet.pdf | |
![]() | X20312HB | X203 SERIES 12-POLE MARKING STRI | datasheet.pdf |