Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-A3PE600-FG256I | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | Copper Wire Rev. C 24/Jun/2013 | |
| Standard Package | 90 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | ProASIC3E | |
| Number of LABs/CLBs | - | |
| Number of Logic Elements/Cells | - | |
| Total RAM Bits | 110592 | |
| Number of I/O | 165 | |
| Number of Gates | 600000 | |
| Voltage - Supply | 1.425 V ~ 1.575 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 256-LBGA | |
| Supplier Device Package | 256-FPBGA (17x17) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | A3PE600-FG256I | |
| Related Links | A3PE600, A3PE600-FG256I Datasheet, Microsemi SoC Distributor | |
![]() | LCM-S02004DTR | LCD MODULE 20X4 CHAR REFL TN | datasheet.pdf | |
![]() | 752103470GP | RES ARRAY 5 RES 47 OHM 10SRT | datasheet.pdf | |
![]() | CP2-GSB25-L | CONN SHIELD LOWER TYPE B 25 | datasheet.pdf | |
![]() | GBM24DTKI | CONN EDGECARD 48POS DIP .156 SLD | datasheet.pdf | |
![]() | PS2801C-1-F3-K-A | OPTOISOLATOR 2.5KV TRANS 4SOIC | datasheet.pdf | |
![]() | T494A106M010AH | CAP TANT 10UF 10V 20% 1206 | datasheet.pdf | |
![]() | M55342E06B13B3R | RES SMD 13.3KOHM 0.1% 0.15W 0805 | datasheet.pdf | |
![]() | 09350120312 | CONN HOUSING FOR MODULAR JACKS | datasheet.pdf | |
![]() | ATS-15D-137-C3-R0 | HEATSINK 25X25X10MM L-TAB T412 | datasheet.pdf | |
![]() | 1-146502-2 | 24 MODII HDR DRST UNSHRD STKG | datasheet.pdf | |
![]() | PS-26SD-D4TS1-2 | CONN HEADER 26POS | datasheet.pdf | |
![]() | C48-00R12-3S8-102 | 26500 3C 3#16 SKT RECP | datasheet.pdf |