Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-A3PN250-2VQG100I | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | Copper Wire Rev. C 24/Jun/2013 | |
| Standard Package | 90 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | ProASIC3 nano | |
| Number of LABs/CLBs | - | |
| Number of Logic Elements/Cells | - | |
| Total RAM Bits | 36864 | |
| Number of I/O | 68 | |
| Number of Gates | 250000 | |
| Voltage - Supply | 1.425 V ~ 1.575 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 100-TQFP | |
| Supplier Device Package | 100-VQFP (14x14) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | A3PN250-2VQG100I | |
| Related Links | A3PN250-, A3PN250-2VQG100I Datasheet, Microsemi SoC Distributor | |
![]() | RG2012N-1470-P-T1 | RES SMD 147 OHM 0.02% 1/8W 0805 | datasheet.pdf | |
![]() | GBB60DHBD-S621 | CONN EDGECARD 120PS R/A .050 SLD | datasheet.pdf | |
![]() | MAX6376XR30+T | IC VOLT DETECT LP 3.00V SC70-3 | datasheet.pdf | |
![]() | S-8521D50MC-BYJT2G | IC REG CTRLR BUCK PWM SOT23-5 | datasheet.pdf | |
![]() | 1800469 | BUT. B/W PR. 4 | datasheet.pdf | |
![]() | ATS-02F-20-C2-R0 | HEATSINK 54X54X25MM XCUT T766 | datasheet.pdf | |
![]() | ATS-21G-65-C1-R0 | HEATSINK 40X40X30MM L-TAB | datasheet.pdf | |
![]() | ATS-08C-07-C3-R0 | HEATSINK 45X45X12.7MM XCUT T412 | datasheet.pdf | |
![]() | ATS-19C-46-C3-R0 | HEATSINK 25X25X25MM L-TAB T412 | datasheet.pdf | |
![]() | BFC247964304 | CAP FILM 300NF 5% 630VDC RAD | datasheet.pdf | |
![]() | RM46L440CPGET | IC MCU ARM 1.25MB FLASH 144LQFP | datasheet.pdf | |
![]() | GTSL030-18-1P-B20 | GT 10C 10#16 PIN RECP BOX RM | datasheet.pdf |