Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-A42MX09-3TQ176 | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Obsolescence/ EOL | Multiple Devices 15/Dec/2014 | |
| Standard Package | 40 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | MX | |
| Number of LABs/CLBs | - | |
| Number of Logic Elements/Cells | - | |
| Total RAM Bits | - | |
| Number of I/O | 104 | |
| Number of Gates | 14000 | |
| Voltage - Supply | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | 0°C ~ 70°C | |
| Package / Case | 176-LQFP | |
| Supplier Device Package | 176-TQFP (24x24) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | A42MX09-3TQ176 | |
| Related Links | A42MX09, A42MX09-3TQ176 Datasheet, Microsemi SoC Distributor | |
![]() | RT0603CRE07576RL | RES SMD 576 OHM 0.25% 1/10W 0603 | datasheet.pdf | |
![]() | RGC0805FTC14K7 | RES SMD 14.7K OHM 1% 1/8W 0805 | datasheet.pdf | |
![]() | KLPC1800X | FUSE T/D CLASS L 1800A 600V | datasheet.pdf | |
![]() | NCV7420D24R2G | TXRX LIN 33V VREG 14SOIC | datasheet.pdf | |
![]() | M55342H11B3E32RT5 | RES SMD 3.32K OHM 1% 1/20W 0402 | datasheet.pdf | |
![]() | 10114508-S0J-40B | XCEDE RIGHT 6PVH 4COL WK | datasheet.pdf | |
![]() | ECC25DPES | CONN EDGECARD 50POS .100" | datasheet.pdf | |
![]() | SCH300-X | COPPER SPLICE WITH CORONA RE | datasheet.pdf | |
![]() | TDP43ME-CASE | HARD CASE FOR TDP43ME PRINTER | datasheet.pdf | |
![]() | AZ23B3V3-G3-18 | DIODE ZENER 3.3V 300MW SOT23 | datasheet.pdf | |
![]() | BFC237535222 | CAP FILM 2.2NF 3.5% 1600VDC RAD | datasheet.pdf | |
![]() | CN1020A20G16S9-040 | 26500 16C 16#16 S BY PLUG LC | datasheet.pdf |