Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-A54SX16-CQ208B | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | SX | |
| Number of LABs/CLBs | 1452 | |
| Number of Logic Elements/Cells | - | |
| Total RAM Bits | - | |
| Number of I/O | 175 | |
| Number of Gates | 24000 | |
| Voltage - Supply | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | - | |
| Package / Case | 208-BFCQFP with Tie Bar | |
| Supplier Device Package | 208-CQFP (75x75) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | A54SX16-CQ208B | |
| Related Links | A54SX16, A54SX16-CQ208B Datasheet, Microsemi SoC Distributor | |
![]() | ERT-D3FIL803S | 80K OHM THERMISTOR | datasheet.pdf | |
![]() | ERJ-S12F2701U | RES SMD 2.7K OHM 1% 3/4W 1812 | datasheet.pdf | |
![]() | AMC19DRTI | CONN EDGECARD 38POS .100 DIP SLD | datasheet.pdf | |
![]() | GBC25DRTI | CONN EDGECARD 50POS DIP .100 SLD | datasheet.pdf | |
![]() | 0217.400VXP | FUSE GLASS 400MA 250VAC 5X20MM | datasheet.pdf | |
![]() | 0690025718 | PAINTED RAM | datasheet.pdf | |
![]() | BPA02SBR | SWITCH DIP SIDE 2POS | datasheet.pdf | |
![]() | 1941730000 | BCZ 3.81/16/180LR SN GN BX | datasheet.pdf | |
![]() | RJP50040AB-A | CABLE ASSEMBLY | datasheet.pdf | |
![]() | 8N4QV01LG-0116CDI | IC OSC VCXO QD FREQ 10CLCC | datasheet.pdf | |
![]() | 202F274-51/164-0-CS8064 | BLOW-MOLDED PARTS | datasheet.pdf | |
![]() | SLD51U-017 | TVS DIODE 51VWM 82.4VC AXIAL | datasheet.pdf |