Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-ADCLK944BCPZ-R2 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Mfg Application Notes | Magnetic Resonance Imaging (MRI) Solutions Medical Ultrasound Solutions | |
| PCN Assembly/Origin | LFCSP 2x3,3x3 Assembly Test Site Transfer 18/Oct/2013 Assembly/Test Site Revision B 28/Apr/2014 Assembly/Test Site Revision C 06/Aug/2014 | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 250 | |
| Category | Integrated Circuits (ICs) | |
| Family | Clock/Timing - Clock Buffers, Drivers | |
| Series | SiGe | |
| Packaging | Tape & Reel (TR) | |
| Type | Fanout Buffer (Distribution) | |
| Number of Circuits | 1 | |
| Ratio - Input:Output | 1:4 | |
| Differential - Input:Output | Yes/Yes | |
| Input | CML, CMOS, LVDS, LVPECL | |
| Output | ECL, LVPECL | |
| Frequency - Max | 7GHz | |
| Voltage - Supply | 2.375 V ~ 3.63 V | |
| Operating Temperature | -40°C ~ 85°C | |
| Mounting Type | Surface Mount | |
| Package / Case | 16-WFQFN Exposed Pad, CSP | |
| Supplier Device Package | 16-LFCSP-WQ (3x3) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | ADCLK944BCPZ-R2 | |
| Related Links | ADCLK94, ADCLK944BCPZ-R2 Datasheet, Analog Distributor | |
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