Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-AFS250-2FG256I | |
Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
PCN Design/Specification | DDR Frequency 25/Jan/2013 | |
Standard Package | 90 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - FPGAs (Field Programmable Gate Array) | |
Series | Fusion® | |
Number of LABs/CLBs | - | |
Number of Logic Elements/Cells | - | |
Total RAM Bits | 36864 | |
Number of I/O | 114 | |
Number of Gates | 250000 | |
Voltage - Supply | 1.425 V ~ 1.575 V | |
Mounting Type | Surface Mount | |
Operating Temperature | -40°C ~ 100°C | |
Package / Case | 256-LBGA | |
Supplier Device Package | 256-FPBGA (17x17) | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | AFS250-2FG256I | |
Related Links | AFS250-, AFS250-2FG256I Datasheet, Microsemi SoC Distributor |
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