Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-AFS250-FGG256I | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | DDR Frequency 25/Jan/2013 | |
| Standard Package | 90 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | Fusion® | |
| Number of LABs/CLBs | - | |
| Number of Logic Elements/Cells | - | |
| Total RAM Bits | 36864 | |
| Number of I/O | 114 | |
| Number of Gates | 250000 | |
| Voltage - Supply | 1.425 V ~ 1.575 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | -40°C ~ 100°C | |
| Package / Case | 256-LBGA | |
| Supplier Device Package | 256-FPBGA (17x17) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | AFS250-FGG256I | |
| Related Links | AFS250-, AFS250-FGG256I Datasheet, Microsemi SoC Distributor | |
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