Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-AFS600-2FGG484 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | DDR Frequency 25/Jan/2013 | |
| Standard Package | 60 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | Fusion® | |
| Number of LABs/CLBs | - | |
| Number of Logic Elements/Cells | - | |
| Total RAM Bits | 110592 | |
| Number of I/O | 172 | |
| Number of Gates | 600000 | |
| Voltage - Supply | 1.425 V ~ 1.575 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | 0°C ~ 85°C | |
| Package / Case | 484-BGA | |
| Supplier Device Package | 484-FPBGA (23x23) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | AFS600-2FGG484 | |
| Related Links | AFS600-, AFS600-2FGG484 Datasheet, Microsemi SoC Distributor | |
![]() | 4306R-102-183 | RES ARRAY 3 RES 18K OHM 6SIP | datasheet.pdf | |
![]() | HBC65DRYH-S93 | CONN EDGECARD 130PS DIP .100 SLD | datasheet.pdf | |
![]() | 9-1879133-4 | RES SMD 8.25KOHM 0.1% 1/16W 0603 | datasheet.pdf | |
![]() | 0638207570 | TOOL KIT | datasheet.pdf | |
![]() | UNL15W13K-F | CAP FILM 13UF 10% 1.5KVDC RADIAL | datasheet.pdf | |
![]() | ATS-04G-115-C2-R0 | HEATSINK 40X40X20MM XCUT T766 | datasheet.pdf | |
![]() | ATS-10E-188-C3-R0 | HEATSINK 45X45X15MM R-TAB T412 | datasheet.pdf | |
| IS42VM16400K-75BLI-TR | IC SDRAM 64M 133MHZ 54BGA | datasheet.pdf | ||
![]() | 209-3-1-66-4-8-2.5 | CIR BRKR MAG-HYDR 2.5A 240VAC | datasheet.pdf | |
![]() | MS27508E20B41AA | JT 41C 41#16 PIN WALL RECP | datasheet.pdf | |
![]() | TV06RQK-21-79P | TV 19C 17#22D 2#8(QUAD) PIN RE | datasheet.pdf | |
![]() | LQG21F1R0N00 | Capacitors Inductors Filters... | datasheet.pdf |