Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-AGL400V5-FG256 | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | Copper Wire Rev. C 24/Jun/2013 | |
| Standard Package | 90 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | IGLOO | |
| Number of LABs/CLBs | - | |
| Number of Logic Elements/Cells | 9216 | |
| Total RAM Bits | 55296 | |
| Number of I/O | 178 | |
| Number of Gates | 400000 | |
| Voltage - Supply | 1.425 V ~ 1.575 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | 0°C ~ 70°C | |
| Package / Case | 256-LBGA | |
| Supplier Device Package | 256-FPBGA (17x17) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | AGL400V5-FG256 | |
| Related Links | AGL400V, AGL400V5-FG256 Datasheet, Microsemi SoC Distributor | |
![]() | CRCW08052R80FNTA | RES SMD 2.8 OHM 1% 1/8W 0805 | datasheet.pdf | |
![]() | ECA14DTKH | CONN EDGECARD 28POS DIP .125 SLD | datasheet.pdf | |
![]() | GBA30DTKN | CONN EDGECARD 60POS DIP .125 SLD | datasheet.pdf | |
![]() | 55510-010LF | Connector Receptacle 10 Position 0.079" (2.00mm) Gold Surface Mount | datasheet.pdf | |
![]() | FXO-LC526R-100 | OSC XO 100.000MHZ LVDS SMD | datasheet.pdf | |
![]() | RNC60J6653BSB14 | RES 665K OHM 1/4W .1% AXIAL | datasheet.pdf | |
![]() | RN60E8253FBSL | RES 825K OHM 1/4W 1% AXIAL | datasheet.pdf | |
![]() | CMF552K6700BERE70 | RES 2.67K OHM 1/2W .1% AXIAL | datasheet.pdf | |
![]() | CMF552R0000FKEA | RES 2 OHM 1/2W 1% AXIAL | datasheet.pdf | |
![]() | 4634R | PEDESTAL SPLICE CLOSURE REENTRY | datasheet.pdf | |
![]() | HW21700000J0G | 500 TB SPR PLU DOWN/SIDE | datasheet.pdf | |
![]() | FC-135 32.7680KA-AC5 | CRYSTAL 32.7680 KHZ 9.0PF SMD | datasheet.pdf |