Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-AGLE600V5-FGG484I | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
PCN Design/Specification | Gold to Palladium Coated Copper Wire Chg 5/Nov/2015 | |
Standard Package | 60 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - FPGAs (Field Programmable Gate Array) | |
Series | IGLOOe | |
Number of LABs/CLBs | - | |
Number of Logic Elements/Cells | 13824 | |
Total RAM Bits | 110592 | |
Number of I/O | 270 | |
Number of Gates | 600000 | |
Voltage - Supply | 1.425 V ~ 1.575 V | |
Mounting Type | Surface Mount | |
Operating Temperature | -40°C ~ 85°C | |
Package / Case | 484-BGA | |
Supplier Device Package | 484-FPBGA (23x23) | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | AGLE600V5-FGG484I | |
Related Links | AGLE600V, AGLE600V5-FGG484I Datasheet, Microsemi SoC Distributor |
![]() | MAX265BCPI | IC FILTER ACT PROG 28-DIP | datasheet.pdf | |
![]() | HCC26DRYH-S734 | CONN EDGECARD 52POS DIP .100 SLD | datasheet.pdf | |
![]() | GMA28DTMD | CONN EDGECARD 56POS R/A .125 SLD | datasheet.pdf | |
![]() | SLP123M025A9P3 | CAP ALUM 12000UF 20% 25V SNAP | datasheet.pdf | |
![]() | REC5-2405SRW/H/B/SMD-R | CONV DC/DC 5W 18-36VIN 05VOUT | datasheet.pdf | |
![]() | RNC55H3121BSRE6 | RES 3.12K OHM 1/8W .1% AXIAL | datasheet.pdf | |
![]() | B41252B9338M | CAP ALUM 3300UF 20% 100V SNAP | datasheet.pdf | |
![]() | CMF601M5000FKEA70 | RES 1.5M OHM 1W 1% AXIAL | datasheet.pdf | |
![]() | 5129/15C SL001 | MULTI-PAIR 30COND 22AWG 1000' | datasheet.pdf | |
![]() | CR0805-JW-202ELF | RES SMD 2K OHM 5% 1/8W 0805 | datasheet.pdf | |
![]() | ATS-12F-127-C1-R0 | HEATSINK 54X54X20MM XCUT | datasheet.pdf | |
![]() | 55/P1324-20-0/9-9CS3192 | 55/ CABLE OUTER SPACE | datasheet.pdf |