Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-AMC55DTMN-S664 | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Standard Package | 1 | |
Category | Connectors, Interconnects | |
Family | Card Edge Connectors - Edgeboard Connectors | |
Series | - | |
Packaging | Tray | |
Card Type | Non Specified - Dual Edge | |
Gender | Female | |
Number of Positions/Bay/Row | 55 | |
Number of Positions | 110 | |
Card Thickness | 0.125" (3.18mm) | |
Number of Rows | 2 | |
Pitch | 0.100" (2.54mm) | |
Features | - | |
Mounting Type | Through Hole, Right Angle | |
Termination | Solder | |
Contact Material | Beryllium Copper | |
Contact Finish | Gold | |
Contact Finish Thickness | 30µin (0.76µm) | |
Contact Type | Loop Bellows | |
Color | - | |
Flange Feature | - | |
Operating Temperature | -65°C ~ 150°C | |
Material - Insulation | Polyphenylene Sulfide (PPS) | |
Read Out | Dual | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | AMC55DTMN-S664 | |
Related Links | AMC55DT, AMC55DTMN-S664 Datasheet, Sullins Connector Solutions Distributor |
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