Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-APA150-FGG256I | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | Copper Wire Rev. C 24/Jun/2013 | |
| Standard Package | 90 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | ProASICPLUS | |
| Number of LABs/CLBs | - | |
| Number of Logic Elements/Cells | - | |
| Total RAM Bits | 36864 | |
| Number of I/O | 186 | |
| Number of Gates | 150000 | |
| Voltage - Supply | 2.3 V ~ 2.7 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 256-LBGA | |
| Supplier Device Package | 256-FPBGA (17x17) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | APA150-FGG256I | |
| Related Links | APA150-, APA150-FGG256I Datasheet, Microsemi SoC Distributor | |
![]() | XCV300-6PQ240C | IC FPGA 166 I/O 240PQFP | datasheet.pdf | |
![]() | MCR10EZHJ512 | RES SMD 5.1K OHM 5% 1/8W 0805 | datasheet.pdf | |
![]() | LT1528CQ#TRPBF | IC REG LDO 3.3V/ADJ 3A 5DDPAK | datasheet.pdf | |
![]() | RS3K-E3/57T | DIODE GEN PURP 800V 3A DO214AB | datasheet.pdf | |
![]() | MCR18EZPJ512 | RES SMD 5.1K OHM 5% 1/4W 1206 | datasheet.pdf | |
![]() | RG2012V-6490-C-T5 | RES SMD 649 OHM 0.25% 1/8W 0805 | datasheet.pdf | |
![]() | PF1262-4R7F1 | RES 4.7 OHM 20W 1% TO126 | datasheet.pdf | |
![]() | CW01050R50JE73 | RES 50.5 OHM 10W 5% AXIAL | datasheet.pdf | |
![]() | VE-B3R-EX-F4 | CONVERTER MOD DC/DC 7.5V 75W | datasheet.pdf | |
| UMW1HR47MDD1TP | CAP ALUM 0.47UF 20% 50V RADIAL | datasheet.pdf | ||
![]() | S70FL256P0XBHI203 | IC FLASH 256MBIT | datasheet.pdf | |
![]() | YK31321030J0G | Connector Barrier Block Strip 21 Circuit 0.300" (7.62mm) | datasheet.pdf |