Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-APA300-FG144I | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | Copper Wire Rev. C 24/Jun/2013 | |
| Standard Package | 160 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | ProASICPLUS | |
| Number of LABs/CLBs | - | |
| Number of Logic Elements/Cells | - | |
| Total RAM Bits | 73728 | |
| Number of I/O | 100 | |
| Number of Gates | 300000 | |
| Voltage - Supply | 2.3 V ~ 2.7 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 144-LBGA | |
| Supplier Device Package | 144-FPBGA (13x13) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | APA300-FG144I | |
| Related Links | APA300, APA300-FG144I Datasheet, Microsemi SoC Distributor | |
![]() | LQ043Y1DX05 | LCD DISP TFT 4.3" B/L | datasheet.pdf | |
![]() | NCP3126CRAGEVB | BOARD EVALUATION NCP3126 CERAMIC | datasheet.pdf | |
![]() | SA105A101JAR | CAP CER 100PF 50V NP0 AXIAL | datasheet.pdf | |
![]() | RNC60H1264BSRE6 | RES 1.26M OHM 1/4W .1% AXIAL | datasheet.pdf | |
![]() | RN55E1051BBSL | RES 1.05K OHM 1/8W .1% AXIAL | datasheet.pdf | |
![]() | RN60D3650FRSL | RES 365 OHM 1/4W 1% AXIAL | datasheet.pdf | |
![]() | MX25L6435EZNI-10G | IC FLASH 64MBIT 104MHZ 8WSON | datasheet.pdf | |
![]() | NTHS1206N02N1002JR | THERMISTOR NTC 10K OHM 5% 1206 | datasheet.pdf | |
![]() | ER1025-15JS | FIXED IND 620NH 495MA 600 MOHM | datasheet.pdf | |
![]() | 680300-3 | HDM TAPE 9CB G | datasheet.pdf | |
![]() | BFC233623683 | CAP FILM 68NF 20% 310VAC RADIAL | datasheet.pdf | |
![]() | TV07RS-15-55P-P15AD | HD 38999 55C 55#23 PIN RECP | datasheet.pdf |