Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-APA600-FG676I | |
Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Standard Package | 40 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - FPGAs (Field Programmable Gate Array) | |
Series | ProASICPLUS | |
Number of LABs/CLBs | - | |
Number of Logic Elements/Cells | - | |
Total RAM Bits | 129024 | |
Number of I/O | 454 | |
Number of Gates | 600000 | |
Voltage - Supply | 2.3 V ~ 2.7 V | |
Mounting Type | Surface Mount | |
Operating Temperature | -40°C ~ 85°C | |
Package / Case | 676-BGA | |
Supplier Device Package | 676-FBGA (27x27) | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | APA600-FG676I | |
Related Links | APA600, APA600-FG676I Datasheet, Microsemi SoC Distributor |
![]() | TS271IN | IC OPAMP GP 100KHZ 8DIP | datasheet.pdf | |
![]() | FQPF7N40 | MOSFET N-CH 400V 4.6A TO-220F | datasheet.pdf | |
S10451 | WASHER FLAT 3/8 COPPER ALLOY | datasheet.pdf | ||
![]() | 1537-50H | FIXED IND 30UH 191MA 2.8 OHM TH | datasheet.pdf | |
![]() | ATS-18F-56-C3-R0 | HEATSINK 35X35X15MM L-TAB T412 | datasheet.pdf | |
![]() | ATS-P1-65-C2-R0 | HEATSINK 40X40X30MM L-TAB T766 | datasheet.pdf | |
![]() | ATS-02E-121-C3-R0 | HEATSINK 50X50X10MM XCUT T412 | datasheet.pdf | |
![]() | MBB02070C4999DC100 | RES 49.9 OHM 0.6W 0.5% AXIAL | datasheet.pdf | |
![]() | WF095220WF50236BJ1 | CAP CER 5000PF 12KV SCREW | datasheet.pdf | |
![]() | BAT-HLD-012-SMT-TR | RETAINER BATT CR1216/1225 SMD | datasheet.pdf | |
![]() | 97-14S-1P-431 | 10-825206-01P | datasheet.pdf | |
![]() | 97-3108A24-11PZ-940 | AB 9C 6#12, 3#8 PIN PLUG | datasheet.pdf |