Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-APA600-FGG256I | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | Copper Wire Rev. C 24/Jun/2013 | |
| Standard Package | 90 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | ProASICPLUS | |
| Number of LABs/CLBs | - | |
| Number of Logic Elements/Cells | - | |
| Total RAM Bits | 129024 | |
| Number of I/O | 186 | |
| Number of Gates | 600000 | |
| Voltage - Supply | 2.3 V ~ 2.7 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 256-LBGA | |
| Supplier Device Package | 256-FPBGA (17x17) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | APA600-FGG256I | |
| Related Links | APA600-, APA600-FGG256I Datasheet, Microsemi SoC Distributor | |
![]() | VS-1N1183A | DIODE GEN PURP 50V 40A DO203AB | datasheet.pdf | |
![]() | EXB-H6V224J | RES ARRAY 3 RES 220K OHM 6SSIP | datasheet.pdf | |
![]() | 3SB 160 | FUSE GLASS 160MA 250VAC 3AB 3AG | datasheet.pdf | |
![]() | 3862C-122-253A | POT 25K OHM 1W CERMET LINEAR | datasheet.pdf | |
![]() | DNT900P | TXRX MOD 900MHZ FHSS WITH I/O | datasheet.pdf | |
![]() | KPSE00F18-32PX | CONN RCPT 32POS WALL MNT W/PINS | datasheet.pdf | |
![]() | RWR81S2400FPB12 | RES 240 OHM 1W 1% WW AXIAL | datasheet.pdf | |
![]() | KPSE07P14-12P | CONN RCPT 12POS JAM NUT PIN | datasheet.pdf | |
![]() | MI-J2X-IA | CONVERT DC/DC 28VIN 5.2VOUT 10W | datasheet.pdf | |
![]() | PGSB-28 | BUSHING 0.625" NYLON BLACK | datasheet.pdf | |
![]() | CS3100A-16-60S | CONN RCPT 2POS WALL MNT SKT | datasheet.pdf | |
![]() | TV07DZ-19-11JC-LC | TV 11C 11#16 SKT J/N RECP | datasheet.pdf |