Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-APA750-FG676I | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 40 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | ProASICPLUS | |
| Number of LABs/CLBs | - | |
| Number of Logic Elements/Cells | - | |
| Total RAM Bits | 147456 | |
| Number of I/O | 454 | |
| Number of Gates | 750000 | |
| Voltage - Supply | 2.3 V ~ 2.7 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 676-BGA | |
| Supplier Device Package | 676-FBGA (27x27) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | APA750-FG676I | |
| Related Links | APA750, APA750-FG676I Datasheet, Microsemi SoC Distributor | |
![]() | AGM06DRMH | CONN EDGECARD 12POS .156 WW | datasheet.pdf | |
![]() | 0603ZG223ZAT2A | CAP CER 0.022UF 10V Y5V 0603 | datasheet.pdf | |
![]() | MS3101A14S-7P | CONN RCPT 3POS FREE HNG W/PINS | datasheet.pdf | |
![]() | MS3101F18-8P | CONN RCPT 8 POS FREE HNG W/PINS | datasheet.pdf | |
![]() | AT30TS75-XM8-T | SENSOR TEMP I2C/SMBUS 8MSOP | datasheet.pdf | |
![]() | RC3216F274CS | RES SMD 270K OHM 1% 1/4W 1206 | datasheet.pdf | |
![]() | NPPC192LJBN-RC | Connector Header 38 Position 0.100" (2.54mm) Gold Through Hole, Right Angle | datasheet.pdf | |
![]() | SI21622-A40-GMR | IC DEMOD DVB-C2/C/T2/T 68QFN | datasheet.pdf | |
![]() | ATS-05D-198-C2-R0 | HEATSINK 45X45X12MM XCUT T766 | datasheet.pdf | |
![]() | CRCW08053K92FKEB | RES SMD 3.92K OHM 1% 1/8W 0805 | datasheet.pdf | |
![]() | XCR303XL-10PC44I | XILINX IC XCR303XL-10PC44I Available | datasheet.pdf | |
![]() | GCM155R71E223K | Chip Monolithic Ceramic Capacitor 0402 X7R 22nF 25V | datasheet.pdf |