Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-APA750-FGG676I | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 40 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | ProASICPLUS | |
| Number of LABs/CLBs | - | |
| Number of Logic Elements/Cells | - | |
| Total RAM Bits | 147456 | |
| Number of I/O | 454 | |
| Number of Gates | 750000 | |
| Voltage - Supply | 2.3 V ~ 2.7 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 676-BGA | |
| Supplier Device Package | 676-FBGA (27x27) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | APA750-FGG676I | |
| Related Links | APA750-, APA750-FGG676I Datasheet, Microsemi SoC Distributor | |
![]() | MAX181ACPL | IC DAS 6CH 12BIT T/H LP 40-DIP | datasheet.pdf | |
![]() | BAS70-06T-7-F | DIODE ARRAY SCHOTTKY 70V SOT523 | datasheet.pdf | |
| EVAL-ADM3252EEBZ | BOARD EVAL FOR ADM3252E | datasheet.pdf | ||
![]() | RN55D5620FRSL | RES 562 OHM 1/8W 1% AXIAL | datasheet.pdf | |
![]() | REC3-1215SRW/H6/A/M/X2 | DC/DC CONVERTER 15V 3W | datasheet.pdf | |
![]() | ECA10DCCS | CONN EDGECARD 20POS .125" | datasheet.pdf | |
![]() | ATS-13D-86-C3-R0 | HEATSINK 35X35X15MM R-TAB T412 | datasheet.pdf | |
![]() | SFCF2048H1BK1MT-I-QT-553-SMA | MEMORY CARD COMPACTFLASH 2GB SLC | datasheet.pdf | |
![]() | 17EHD015PAM000 | D-Sub Connector Plug, Male Pins 15 Position Free Hanging (In-Line) Solder Cup | datasheet.pdf | |
![]() | XPLAWT-00-0000-000UT50E8 | LED XLAMP WARM WHITE 2700K 2SMD | datasheet.pdf | |
![]() | SIT8008ACL8-25S | OSC MEMS PROG 7.0X5.0MM 2.5V | datasheet.pdf | |
![]() | XC7A35T-1FT256I | IC FPGA ARTIX7 250 I/O 256FTBGA | datasheet.pdf |