Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-AS7C3513B-10JCNTR | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 500 | |
| Category | Integrated Circuits (ICs) | |
| Family | Memory | |
| Series | - | |
| Packaging | Tape & Reel (TR) | |
| Format - Memory | RAM | |
| Memory Type | SRAM - Asynchronous | |
| Memory Size | 512K (32K x 16) | |
| Speed | 10ns | |
| Interface | Parallel | |
| Voltage - Supply | 3 V ~ 3.6 V | |
| Operating Temperature | 0°C ~ 70°C | |
| Package / Case | 44-BSOJ (0.400", 10.16mm Width) | |
| Supplier Device Package | 44-SOJ | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | AS7C3513B-10JCNTR | |
| Related Links | AS7C3513, AS7C3513B-10JCNTR Datasheet, Alliance Memory, Inc. Distributor | |
![]() | CY2308SC-3 | IC CLK ZDB 8OUT 133MHZ 16SOIC | datasheet.pdf | |
![]() | ICM7228AIPIZ | IC LED DISPLAY DRVR 8DGT 28-DIP | datasheet.pdf | |
![]() | MT18LSDT6472AY-13ED2 | MODULE SDRAM 512MB 168-DIMM | datasheet.pdf | |
![]() | SLE 66R35 MCC2 | IC MEMORY CHIP 1KBYTE MCC2-2 | datasheet.pdf | |
![]() | 185823K63RAB-F | CAP FILM 0.082UF 10% 63VDC RAD | datasheet.pdf | |
![]() | 0757345002 | CONN STACKED SFP 2X5 ASSY W/LPS | datasheet.pdf | |
| 501CBL-ACAF | OSC PROG 2.5V 1.3NS 30PPM | datasheet.pdf | ||
![]() | 8N4SV76LC-0125CDI8 | IC OSC VCXO 622.08MHZ 6-CLCC | datasheet.pdf | |
![]() | ATR 2157 | TOOL REMOVAL TWEEZER 12 GA | datasheet.pdf | |
![]() | 3011W1SAR99A10X | 11W1 F PC CONTACTS | datasheet.pdf | |
![]() | HI0805N221R-10 | FERRITE CHIP POWER SMD | datasheet.pdf | |
![]() | XQC1000-4BG256M | QPro Virtex 2.5V QML High-Reliability FPGAs IC | datasheet.pdf |