Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-AT89C51RC2-3CSUM | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | ||
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | MCU Product Line Introduction Software Framework (ASF) Example of Use Studio Introduction to Software Framework (ASF) Studio Development Environment Overview Part 1 | |
| Design Resources | Development Tool Selector | |
| PCN Design/Specification | Copper Bonding Wire 17/Apr/2015 | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 216 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontrollers | |
| Series | 89C | |
| Packaging | Tube | |
| Core Processor | 80C51 | |
| Core Size | 8-Bit | |
| Speed | 60MHz | |
| Connectivity | SPI, UART/USART | |
| Peripherals | POR, PWM, WDT | |
| Number of I/O | 32 | |
| Program Memory Size | 32KB (32K x 8) | |
| Program Memory Type | FLASH | |
| EEPROM Size | - | |
| RAM Size | 1.25K x 8 | |
| Voltage - Supply (Vcc/Vdd) | 2.7 V ~ 5.5 V | |
| Data Converters | - | |
| Oscillator Type | External | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 40-DIP (0.600", 15.24mm) | |
| Supplier Device Package | 40-PDIL | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | AT89C51RC2-3CSUM | |
| Related Links | AT89C51R, AT89C51RC2-3CSUM Datasheet, Atmel Distributor | |
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