Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-AT91SAM9XE256B-CU | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Video File | Introducing Atmel Studio 7 | |
| Design Resources | Development Tool Selector | |
| Featured Product | Atmel - ARM-based Embedded MPUs | |
| PCN Design/Specification | Copper Bonding Wire 24/Apr/2015 | |
| Standard Package | 126 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontrollers | |
| Series | SAM9XE | |
| Packaging | Tray | |
| Core Processor | ARM9® | |
| Core Size | 16/32-Bit | |
| Speed | 180MHz | |
| Connectivity | EBI/EMI, Ethernet, I²C, Memory Card, SPI, SSC, UART/USART, USB | |
| Peripherals | Brown-out Detect/Reset, POR, PWM, WDT | |
| Number of I/O | 96 | |
| Program Memory Size | 256KB (256K x 8) | |
| Program Memory Type | FLASH | |
| EEPROM Size | - | |
| RAM Size | 56K x 8 | |
| Voltage - Supply (Vcc/Vdd) | 1.65 V ~ 1.95 V | |
| Data Converters | A/D 4x10b | |
| Oscillator Type | Internal | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 217-LFBGA | |
| Supplier Device Package | 217-BGA (15x15) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | AT91SAM9XE256B-CU | |
| Related Links | AT91SAM9, AT91SAM9XE256B-CU Datasheet, Atmel Distributor | |
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