Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-AX250-1FG256 | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 90 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | Axcelerator | |
| Number of LABs/CLBs | - | |
| Number of Logic Elements/Cells | 2816 | |
| Total RAM Bits | 55296 | |
| Number of I/O | 138 | |
| Number of Gates | 250000 | |
| Voltage - Supply | 1.425 V ~ 1.575 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | 0°C ~ 70°C | |
| Package / Case | 256-LBGA | |
| Supplier Device Package | 256-FPBGA (17x17) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | AX250-1FG256 | |
| Related Links | AX250-, AX250-1FG256 Datasheet, Microsemi SoC Distributor | |
![]() | BZX84C6V2S-7 | DIODE ZENER ARRAY 6.2V SOT363 | datasheet.pdf | |
![]() | RNC55J4533FSB14 | RES 453K OHM 1/8W 1% AXIAL | datasheet.pdf | |
![]() | RER75F2430MC02 | RES CHAS MNT 243 OHM 1% 30W | datasheet.pdf | |
![]() | Q2-3X-3/8-01-QB6IN-16 | HEATSHRINK 3/8"-6" BLACK | datasheet.pdf | |
![]() | APT30SCD120S | DIODE SCHOTTKY 1.2KV 99A D3PAK | datasheet.pdf | |
![]() | T 3274 502 | CONN PLUG 3POS INLINE PIN | datasheet.pdf | |
![]() | 8013840000 | TERMINAL WDK 2.5 GL 330K 230VAC | datasheet.pdf | |
![]() | 1236570000 | BCZ 3.81/07/180FZE SN OR BX | datasheet.pdf | |
![]() | 89H24NT24AG2ZBHLGI | IC PCI SW 24LANE 24PORT 484BGA | datasheet.pdf | |
![]() | ATS-05A-54-C2-R0 | HEATSINK 30X30X35MM L-TAB T766 | datasheet.pdf | |
![]() | 680307-4 | HDM SMPR048F080F G | datasheet.pdf | |
![]() | MP2159GJ-Z | IC REG BUCK ADJ 1A SYNC | datasheet.pdf |