Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-AX250-1FGG256 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 90 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | Axcelerator | |
| Number of LABs/CLBs | - | |
| Number of Logic Elements/Cells | 2816 | |
| Total RAM Bits | 55296 | |
| Number of I/O | 138 | |
| Number of Gates | 250000 | |
| Voltage - Supply | 1.425 V ~ 1.575 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | 0°C ~ 70°C | |
| Package / Case | 256-LBGA | |
| Supplier Device Package | 256-FPBGA (17x17) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | AX250-1FGG256 | |
| Related Links | AX250-, AX250-1FGG256 Datasheet, Microsemi SoC Distributor | |
![]() | AS168X-CB2DH150 | CIR BRKR 15A 480VAC 65VDC | datasheet.pdf | |
![]() | NJU7062M | IC OPAMP GP 400KHZ RRO 8DMP | datasheet.pdf | |
![]() | GBC12DREN-S13 | CONN EDGECARD 24POS .100 EXTEND | datasheet.pdf | |
| SI7112DN-T1-E3 | MOSFET N-CH 30V 11.3A 1212-8 | datasheet.pdf | ||
![]() | IDT71T75602S100PFG8 | IC SRAM 18MBIT 100MHZ 100TQFP | datasheet.pdf | |
![]() | 12LRS155C | FIXED IND 1.5MH 310MA 3.4 OHM TH | datasheet.pdf | |
![]() | RNF-100-1-1/4-BK-SP | HEAT SHRINK TUBING | datasheet.pdf | |
![]() | MS27467T23B53PA-LC | CONN HSG PLUG STRGHT 53POS PIN | datasheet.pdf | |
![]() | 112-503JAF-B01 | 112 DISCRETE THERMS LARGE | datasheet.pdf | |
![]() | CMF20274K00GNEA | RES 274K OHM 1W 2% AXIAL | datasheet.pdf | |
![]() | 42A36-03-1-05N | SWITCH ROTARY SP5T SOLDER LUG | datasheet.pdf | |
![]() | ATS-05G-158-C1-R0 | HEATSINK 40X40X35MM L-TAB | datasheet.pdf |