Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-AX500-1FGG676I | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 40 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | Axcelerator | |
| Number of LABs/CLBs | - | |
| Number of Logic Elements/Cells | 5376 | |
| Total RAM Bits | 73728 | |
| Number of I/O | 336 | |
| Number of Gates | 500000 | |
| Voltage - Supply | 1.425 V ~ 1.575 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 676-BGA | |
| Supplier Device Package | 676-FBGA (27x27) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | AX500-1FGG676I | |
| Related Links | AX500-1, AX500-1FGG676I Datasheet, Microsemi SoC Distributor | |
![]() | 7090.9010.55 | FUSE HLDR CARTRIDGE 125V 7A SMD | datasheet.pdf | |
![]() | MPI-650-24 | XFRMR LAMINATED 650VA CHAS MOUNT | datasheet.pdf | |
![]() | GEC30DRYS-S93 | CONN EDGECARD 60POS DIP .100 SLD | datasheet.pdf | |
![]() | GSM18DSEH-S13 | CONN EDGECARD 36POS .156 EXTEND | datasheet.pdf | |
![]() | IXTT20P50P | MOSFET P-CH 500V 20A TO-268 | datasheet.pdf | |
![]() | M39006/21-0019 | CAP TANT 560UF 20% 10V AXIAL | datasheet.pdf | |
![]() | V300B3V3H100BS3 | CONVERTER MOD DC/DC 3.3V 100W | datasheet.pdf | |
![]() | V24B24C200BS3 | CONVERTER MOD DC/DC 24V 200W | datasheet.pdf | |
![]() | 54111-101050850LF | HEADER BERGSTIK STR | datasheet.pdf | |
![]() | ATS-13C-66-C1-R0 | HEATSINK 40X40X35MM L-TAB | datasheet.pdf | |
| MPG06DHE3_A/54 | DIODE GEN PURP 200V 1A MPG06 | datasheet.pdf | ||
| BYW83TAP | DIODE AVALANCHE 400V 3A SOD64 | datasheet.pdf |