Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-B158-H8961-X-X-7600 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Design Resources | Development Tool Selector | |
| Standard Package | 1 | |
| Category | Programmers, Development Systems | |
| Family | Evaluation Boards - Embedded - MCU, DSP | |
| Series | XC16x | |
| Board Type | Evaluation Platform | |
| Type | MCU 16-Bit | |
| Core Processor | C166SV2 | |
| Operating System | - | |
| Platform | Easy Kit | |
| For Use With/Related Products | XC164CM | |
| Mounting Type | Fixed | |
| Contents | Board(s), Cable(s) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | B158-H8961-X-X-7600 | |
| Related Links | B158-H896, B158-H8961-X-X-7600 Datasheet, Infineon Technologies Distributor | |
![]() | ECE-A0GKS101 | CAP ALUM 100UF 20% 4V RADIAL | datasheet.pdf | |
![]() | RG1608V-4121-B-T5 | RES SMD 4.12KOHM 0.1% 1/10W 0603 | datasheet.pdf | |
![]() | ISL22326WFV14Z | IC POT DGTL 128TP LN LP 14-TSSOP | datasheet.pdf | |
![]() | ECQ-E4473RJF | CAP FILM 0.047UF 5% 400VDC RAD | datasheet.pdf | |
![]() | CA12081_OSS-2-WWW | LENS ASSY 1P 21.6X21.6MM 13.9MM | datasheet.pdf | |
![]() | MCA12060C1000FP500 | RES SMD 100 OHM 1% 0.4W 1206 | datasheet.pdf | |
![]() | GP-X3SE | DIA.3.8MM HEAD | datasheet.pdf | |
![]() | 081040801340 | PMI BASE 11/16 NEON BAY SOLDER | datasheet.pdf | |
![]() | FMB40DYHR | CONN EDGE DUAL .050 TH 80POS | datasheet.pdf | |
![]() | HMC376LP3E | IC MMIC AMP LNA HI IP3 16-QFN | datasheet.pdf | |
![]() | BFC237668752 | CAP FILM 7.5NF 5% 630VDC RAD | datasheet.pdf | |
![]() | GCM1555C1H3R0CZ13D | Ceramic Capacitors 3PF 50V NP0 0402 | datasheet.pdf |