Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-B32621A5124J | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | B32(5679)B333 Series 02/May/2014 | |
| Standard Package | 4,000 | |
| Category | Capacitors | |
| Family | Film Capacitors | |
| Series | B32621 | |
| Packaging | Bulk | |
| Capacitance | 0.012µF | |
| Tolerance | ±5% | |
| Voltage Rating - AC | 90V | |
| Voltage Rating - DC | 160V | |
| Dielectric Material | Polypropylene (PP), Metallized - Stacked | |
| ESR (Equivalent Series Resistance) | - | |
| Operating Temperature | -55°C ~ 105°C | |
| Mounting Type | Through Hole | |
| Package / Case | Radial | |
| Size / Dimension | - | |
| Height - Seated (Max) | - | |
| Termination | PC Pins | |
| Lead Spacing | 0.394" (10.00mm) | |
| Applications | High Pulse, DV/DT | |
| Features | - | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | B32621A5124J | |
| Related Links | B32621, B32621A5124J Datasheet, EPCOS (TDK) Distributor | |
![]() | MIC5239-3.0BM-TR | IC REG LDO 3V 0.5A 8SOIC | datasheet.pdf | |
![]() | EBM25DRMT-S288 | CONN EDGECARD 50POS .156 EXTEND | datasheet.pdf | |
![]() | 3612KL-05W-B39-B50 | FAN AXIAL 92X32MM 24VDC WIRE | datasheet.pdf | |
![]() | 202F253-71-0 | BOOT MOLDED | datasheet.pdf | |
![]() | 7203SPHCQE | SWITCH TOGGLE DPDT 5A 120V | datasheet.pdf | |
![]() | LH-CCJ5 | EXTENSION CABLE 5M FOR LH-50 | datasheet.pdf | |
![]() | 1950492 | TERM BLOCK PLUG | datasheet.pdf | |
![]() | CA3102E20-22SBF80A176 | CONN RCPT 6POS BOX MNT SKT | datasheet.pdf | |
![]() | EE-SX950P-R 1M | STD 5MM PW PNP 1M ROBOTIC | datasheet.pdf | |
![]() | MC9S08PA60VLFR | IC MCU 8BIT 60KB FLASH 48LQFP | datasheet.pdf | |
![]() | 25SVPG15M | CAP POLYMER 15UF 20% 25V SMD | datasheet.pdf | |
![]() | LDB311G6010C-300 | Chip Multilayer Hybrid Baluns | datasheet.pdf |