Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-BACC63CD32A17PYH | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1 | |
| Category | Connectors, Interconnects | |
| Family | Circular Connectors - Housings | |
| Series | * | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | BACC63CD32A17PYH | |
| Related Links | BACC63CD, BACC63CD32A17PYH Datasheet, Amphenol Aerospace Operations Distributor | |
![]() | HSM12DRTN | CONN EDGECARD 24POS DIP .156 SLD | datasheet.pdf | |
![]() | RCM15DCAD | CONN EDGECARD 30POS R/A .156 SLD | datasheet.pdf | |
![]() | RNC55J1214BSB14 | RES 1.21M OHM 1/8W .1% AXIAL | datasheet.pdf | |
![]() | PIC16F1786-E/ML | IC MCU 8BIT 14KB FLASH 28QFN | datasheet.pdf | |
![]() | 1028410000 | CONN TERM BLOCK R/A 16POS 3.5MM | datasheet.pdf | |
![]() | DSPIC33EP256GM710-H/BG | IC DSC 16BIT 256KB FLASH 121XBGA | datasheet.pdf | |
![]() | ATS-13F-129-C1-R0 | HEATSINK 60X60X10MM XCUT | datasheet.pdf | |
![]() | ATS-H1-178-C2-R0 | HEATSINK 35X35X25MM R-TAB T766 | datasheet.pdf | |
![]() | BFC237514512 | CAP FILM 5.1NF 5% 630VDC RAD | datasheet.pdf | |
![]() | MKP383236063JDA2B0 | CAP FILM 630VDC 0.0036UF RADIAL | datasheet.pdf | |
![]() | EP1C4Q100I8 | Cyclone FPGA Family IC | datasheet.pdf | |
![]() | XQ95288-10BG352N | XILINX IC XQ95288-10BG352N Available | datasheet.pdf |