Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-BACC63CE22-2P | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1 | |
| Category | Connectors, Interconnects | |
| Family | Circular Connectors | |
| Series | * | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | BACC63CE22-2P | |
| Related Links | BACC63, BACC63CE22-2P Datasheet, Amphenol Aerospace Operations Distributor | |
![]() | 4866 | RND STANDOFF 6-32 S STEEL 1.65MM | datasheet.pdf | |
![]() | RG1005N-1072-C-T10 | RES SMD 10.7K OHM 1/16W 0402 | datasheet.pdf | |
![]() | EMC43DRAH-S734 | CONN EDGECARD 86POS .100 R/A PCB | datasheet.pdf | |
| LAR2E331MELA25 | CAP ALUM 330UF 20% 250V SNAP | datasheet.pdf | ||
| UZR1H3R3MCL1GB | CAP ALUM 3.3UF 20% 50V SMD | datasheet.pdf | ||
![]() | 714-87-115-31-018101 | PCB CONN CARRIER 2.54MM | datasheet.pdf | |
![]() | 5SGXMA5N2F45I3LN | IC FPGA 840 I/O 1932FBGA | datasheet.pdf | |
![]() | 2510-80J | FIXED IND 220UH 38MA 32 OHM SMD | datasheet.pdf | |
![]() | F20J1K25E | RES CHAS MNT 1.25K OHM 5% 20W | datasheet.pdf | |
![]() | ATS-01B-96-C2-R0 | HEATSINK 40X40X35MM R-TAB T766 | datasheet.pdf | |
![]() | OQ15550000J0G | 508 TB SOCKET WF VER | datasheet.pdf | |
![]() | 1855043-3 | HDM W/FA SMPR080F090O G (CUTS) | datasheet.pdf |