Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-BACC63DB25-4PAH | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1 | |
| Category | Connectors, Interconnects | |
| Family | Circular Connectors - Housings | |
| Series | * | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | BACC63DB25-4PAH | |
| Related Links | BACC63D, BACC63DB25-4PAH Datasheet, Amphenol Aerospace Operations Distributor | |
![]() | M3BYK-1618J | IDC CABLE - MSR16K/MC16G/MPD16K | datasheet.pdf | |
![]() | PIC16C54-RCI/SS | IC MCU 8BIT 768B OTP 20SSOP | datasheet.pdf | |
![]() | 97-3102A-22-14P | CONN RECEPT BOX MNT 19POS W/PINS | datasheet.pdf | |
![]() | RG2012N-8060-W-T1 | RES SMD 806 OHM 0.05% 1/8W 0805 | datasheet.pdf | |
![]() | HCT802TX | MOSFET N/P-CH 90V 2A/1.1A SMD | datasheet.pdf | |
![]() | L-15F10RJV4E | FIXED IND 10UH 80MA SMD | datasheet.pdf | |
![]() | RNC50H5832BSRE6 | RES 58.3K OHM 1/10W .1% AXIAL | datasheet.pdf | |
| CSM-360-W40S-D22-GX500 | BIG CHIP LED HB MOD WHITE 3600LM | datasheet.pdf | ||
![]() | S1210R-563H | FIXED IND 56UH 160MA 6.3 OHM SMD | datasheet.pdf | |
![]() | M2GL090S-1FGG484I | IC FPGA 267 I/O 484FBGA | datasheet.pdf | |
![]() | ATS-14G-119-C3-R0 | HEATSINK 45X45X20MM XCUT T412 | datasheet.pdf | |
![]() | VJ0603D7R5DXAAP | CAP CER 7.5PF 50V NP0 0603 | datasheet.pdf |