Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-BAS21J,115 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | Resin Hardener 02/Jul/2013 Bond Wiring Chg 06/Sep/2015 Bonding Wire Revision 28/Sep/2015 SOD323F Bond Wire Au to Cu & 2nd Source Mold Comp 2/Nov/2015 | |
| PCN Packaging | Lighter Reels 02/Jan/2014 | |
| Standard Package | 3,000 | |
| Category | Discrete Semiconductor Products | |
| Family | Diodes, Rectifiers - Single | |
| Series | - | |
| Packaging | Tape & Reel (TR) | |
| Diode Type | Standard | |
| Voltage - DC Reverse (Vr) (Max) | 300V | |
| Current - Average Rectified (Io) | 250mA (DC) | |
| Voltage - Forward (Vf) (Max) @ If | 1.1V @ 100mA | |
| Speed | Fast Recovery =< 500ns, > 200mA (Io) | |
| Reverse Recovery Time (trr) | 50ns | |
| Current - Reverse Leakage @ Vr | 150nA @ 250V | |
| Capacitance @ Vr, F | 2pF @ 0V, 1MHz | |
| Mounting Type | Surface Mount | |
| Package / Case | SC-90, SOD-323F | |
| Supplier Device Package | SOD-323F | |
| Operating Temperature - Junction | 150°C (Max) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | BAS21J,115 | |
| Related Links | BAS21, BAS21J,115 Datasheet, NXP Semiconductors/Freescale Semiconductor, Inc. Distributor | |
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