Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-BAS316,135 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | Resin Hardener 02/Jul/2013 Copper Bond Wire 26/Oct/2013 Copper Bond Wire 14/Dec/2013 BAS Data Sheet Update 22/Aug/2014 | |
| PCN Packaging | Lighter Reels 02/Jan/2014 | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 10,000 | |
| Category | Discrete Semiconductor Products | |
| Family | Diodes, Rectifiers - Single | |
| Series | - | |
| Packaging | Tape & Reel (TR) | |
| Diode Type | Standard | |
| Voltage - DC Reverse (Vr) (Max) | 100V | |
| Current - Average Rectified (Io) | 250mA (DC) | |
| Voltage - Forward (Vf) (Max) @ If | 1.25V @ 150mA | |
| Speed | Fast Recovery =< 500ns, > 200mA (Io) | |
| Reverse Recovery Time (trr) | 4ns | |
| Current - Reverse Leakage @ Vr | 500nA @ 80V | |
| Capacitance @ Vr, F | 1.5pF @ 0V, 1MHz | |
| Mounting Type | Surface Mount | |
| Package / Case | SC-76, SOD-323 | |
| Supplier Device Package | SOD-323 | |
| Operating Temperature - Junction | 150°C (Max) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | BAS316,135 | |
| Related Links | BAS31, BAS316,135 Datasheet, NXP Semiconductors/Freescale Semiconductor, Inc. Distributor | |
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