Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-BBL-118-T-E | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | ||
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Product Training Modules | Board-to-Board Connectors | |
Featured Product | Board-To-Board Interconnect Systems | |
Standard Package | 1 | |
Category | Connectors, Interconnects | |
Family | Rectangular - Board to Board Connectors - Headers, Male Pins | |
Series | BBL | |
Packaging | Bulk | |
Connector Type | Unshrouded | |
Number of Positions | 18 | |
Number of Positions Loaded | All | |
Pitch | 0.100" (2.54mm) | |
Number of Rows | 1 | |
Row Spacing | - | |
Height Stacking (Mating) | - | |
Molding Height Above Board | 0.070" (1.78mm) | |
Contact Mating Length | 0.105" (2.67mm) | |
Mounting Type | Through Hole | |
Termination | Solder | |
Contact Finish | Tin | |
Contact Finish Thickness | - | |
Features | - | |
Color | Black | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | BBL-118-T-E | |
Related Links | BBL-1, BBL-118-T-E Datasheet, Samtec, Inc. Distributor |
L7812ACD2T-TR | IC REG LDO 12V 1.5A D2PAK | datasheet.pdf | ||
PIC16F877T-20I/PT | IC MCU 8BIT 14KB FLASH 44TQFP | datasheet.pdf | ||
LQH32CN561K23L | FIXED IND 560UH 60MA 22 OHM SMD | datasheet.pdf | ||
HSC40DRTS-S734 | CONN EDGECARD 80POS DIP .100 SLD | datasheet.pdf | ||
RMC60DRYS-S93 | CONN EDGECARD 120PS DIP .100 SLD | datasheet.pdf | ||
0805ZD104KAT2A | CAP CER 0.1UF 10V X5R 0805 | datasheet.pdf | ||
TNY375DG-TL | IC OFFLINE SWIT UVLO 8SOIC | datasheet.pdf | ||
RWR89S5R00DMB12 | RES 5 OHM 3W 0.5% WW AXIAL | datasheet.pdf | ||
S1008-751F | FIXED IND 750NH 735MA 210 MOHM | datasheet.pdf | ||
LCMD120-10CD-X | LUG COPPER 2 HOLE | datasheet.pdf | ||
1472980-1 | RELAY | datasheet.pdf | ||
CTVP00RW-19-35B | CTV 66C 66#22D SKT RECP | datasheet.pdf |