Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-BF861B,235 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 10,000 | |
| Category | Discrete Semiconductor Products | |
| Family | RF FETs | |
| Series | - | |
| Packaging | Tape & Reel (TR) | |
| Transistor Type | N-Channel JFET | |
| Frequency | - | |
| Gain | - | |
| Voltage - Test | - | |
| Current Rating | 15mA | |
| Noise Figure | - | |
| Current - Test | - | |
| Power - Output | - | |
| Voltage - Rated | 25V | |
| Package / Case | TO-236-3, SC-59, SOT-23-3 | |
| Supplier Device Package | SOT-23 (TO-236AB) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | BF861B,235 | |
| Related Links | BF861, BF861B,235 Datasheet, NXP Semiconductors/Freescale Semiconductor, Inc. Distributor | |
![]() | 0201155 | TERM BLOCK INSERTION BRIDGE 2POS | datasheet.pdf | |
![]() | MC78L12BP-AP | IC REG LDO 12V 0.1A TO92 | datasheet.pdf | |
![]() | ATS-51375D-C1-R0 | HEAT SINK 37.5 X 37.5 X 9.5MM | datasheet.pdf | |
![]() | 5960-07 | FUSE CLIP CARTRIDGE CHASSIS MNT | datasheet.pdf | |
![]() | ST2-16B43 | XFRMR LAMINATED 1.1VA THRU HOLE | datasheet.pdf | |
![]() | HBZ472MBBSVEKR | CAP CER 4700PF 2KV RADIAL | datasheet.pdf | |
![]() | VE-J71-IY-F2 | CONVERTER MOD DC/DC 12V 50W | datasheet.pdf | |
![]() | RWR81N4R53FRBSL | RES 4.53 OHM 1W 1% WW AXIAL | datasheet.pdf | |
![]() | CA3101E28-16P | CONN RCPT 20POS INLINE W/PINS | datasheet.pdf | |
![]() | CL10C101FB8NNNC | CAP CER 100PF 50V NP0 0603 | datasheet.pdf | |
![]() | ATS-09E-143-C2-R0 | HEATSINK 30X30X20MM L-TAB T766 | datasheet.pdf | |
![]() | ATS-17E-170-C2-R0 | HEATSINK 30X30X15MM R-TAB T766 | datasheet.pdf |