Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-BGA0009-S | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Other Related Documents | Circuit Assembly Instr | |
| Standard Package | 1 | |
| Category | Soldering, Desoldering, Rework Products | |
| Family | Solder Stencils, Templates | |
| Series | * | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | BGA0009-S | |
| Related Links | BGA0, BGA0009-S Datasheet, Chip Quik Distributor | |
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