Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-BM24-20DP/2-0.35V(51) | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 10,000 | |
| Category | Connectors, Interconnects | |
| Family | Rectangular - Board to Board Connectors - Arrays, Edge Type, Mezzanine | |
| Series | BM24 | |
| Packaging | Tape & Reel (TR) | |
| Connector Type | Header, Outer Shroud Contacts | |
| Number of Positions | 22 (20 + 2 Power) | |
| Pitch | 0.014" (0.35mm) | |
| Number of Rows | 2 | |
| Mounting Type | Surface Mount | |
| Features | Solder Retention | |
| Contact Finish | Gold | |
| Contact Finish Thickness | - | |
| Mated Stacking Heights | 0.8mm | |
| Height Above Board | 0.026" (0.65mm) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | BM24-20DP/2-0.35V(51) | |
| Related Links | BM24-20DP/, BM24-20DP/2-0.35V(51) Datasheet, Hirose Electric Co Ltd Distributor | |
![]() | RG1005N-7320-B-T5 | RES SMD 732 OHM 0.1% 1/16W 0402 | datasheet.pdf | |
![]() | RG1608P-1960-W-T1 | RES SMD 196 OHM 0.05% 1/10W 0603 | datasheet.pdf | |
![]() | ECM22DRPN | CONN EDGECARD 44POS DIP .156 SLD | datasheet.pdf | |
![]() | 65863-001 | QKE HDR | datasheet.pdf | |
![]() | CY8C20134-12SXI | IC MCU 8K FLASH 512B 8SOIC | datasheet.pdf | |
![]() | RN55E3010BRSL | RES 301 OHM 1/8W .1% AXIAL | datasheet.pdf | |
![]() | XPCWHT-L1-R250-00AE2 | LED XLAMP COOL WHITE 5700K 2SMD | datasheet.pdf | |
![]() | 10120132-S0E-10DLF | 6P 8C 2W VERT XCHD RIGHT WK | datasheet.pdf | |
![]() | FX8C-140P-SV2(71) | CONN HEADER 140POS .6MM GOLD SMD | datasheet.pdf | |
![]() | AF8GSMEL-OEM | VERTICAL SATA 8GB MLC | datasheet.pdf | |
![]() | M2GL090-1FCS325I | IC FPGA 425 I/O | datasheet.pdf | |
![]() | 97-3108A18-4PW-940 | AB 4C 4#16 PIN PLUG | datasheet.pdf |