Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-BR25L010FVT-WE2 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | EEPROM Memory Solutions | |
| Standard Package | 3,000 | |
| Category | Integrated Circuits (ICs) | |
| Family | Memory | |
| Series | - | |
| Packaging | Tape & Reel (TR) | |
| Format - Memory | EEPROMs - Serial | |
| Memory Type | EEPROM | |
| Memory Size | 1K (128 x 8) | |
| Speed | 5MHz | |
| Interface | SPI Serial | |
| Voltage - Supply | 1.8 V ~ 5.5 V | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 8-TSSOP (0.173", 4.40mm Width) | |
| Supplier Device Package | 8-TSSOP-B | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | BR25L010FVT-WE2 | |
| Related Links | BR25L01, BR25L010FVT-WE2 Datasheet, Rohm Semiconductor Distributor | |
![]() | RG1608P-9092-C-T5 | RES SMD 90.9K OHM 1/10W 0603 | datasheet.pdf | |
![]() | MAX3244ECUI+T | IC TXRX RS-232 W/SHTDWN 28TSSOP | datasheet.pdf | |
![]() | H60060-3C | FUSE BLOCK CART 600V 60A CHASSIS | datasheet.pdf | |
![]() | PIC18F27J53T-I/SS | IC MCU 8BIT 128KB FLASH 28SSOP | datasheet.pdf | |
![]() | C0402C0G1C3R3C020BC | CAP CER 3.3PF 16V C0G 01005 | datasheet.pdf | |
![]() | DTS20F19-35PA | CONN RCPT 66POS FLANGE W/PINS | datasheet.pdf | |
![]() | SSR-50-W65S-R21-GK100 | BIG CHIP LED HB MODULE WHITE | datasheet.pdf | |
![]() | RER65FR226RC02 | RES CHAS MNT 0.226 OHM 1% 10W | datasheet.pdf | |
![]() | 18-024-110 | DIP CABLE 18POS | datasheet.pdf | |
![]() | PPT0500DFW5VA | PRESSURE TRANSDUCER | datasheet.pdf | |
![]() | ATS-X53190P-C1-R0 | SUPERGRIP HEATSINK 19X19X17.5MM | datasheet.pdf | |
![]() | 860010272005 | CAP 100 UF 20% 10 V | datasheet.pdf |