Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-BSP100,135 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Obsolescence/ EOL | Multiple Devices 05/Jul/2015 | |
| PCN Design/Specification | Resin Hardener 02/Jul/2013 Copper Bond Wire 22/Oct/2014 Copper Wire Update 10/Mar/2015 | |
| PCN Packaging | Lighter Reels 02/Jan/2014 | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 4,000 | |
| Category | Discrete Semiconductor Products | |
| Family | FETs - Single | |
| Series | TrenchMOS™ | |
| Packaging | Tape & Reel (TR) | |
| FET Type | MOSFET N-Channel, Metal Oxide | |
| FET Feature | Standard | |
| Drain to Source Voltage (Vdss) | 30V | |
| Current - Continuous Drain (Id) @ 25°C | 3.2A (Ta) | |
| Rds On (Max) @ Id, Vgs | 100 mOhm @ 2.2A, 10V | |
| Vgs(th) (Max) @ Id | 2.8V @ 1mA | |
| Gate Charge (Qg) @ Vgs | 6nC @ 10V | |
| Input Capacitance (Ciss) @ Vds | 250pF @ 20V | |
| Power - Max | 8.3W | |
| Mounting Type | Surface Mount | |
| Package / Case | TO-261-4, TO-261AA | |
| Supplier Device Package | SC-73 | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | BSP100,135 | |
| Related Links | BSP10, BSP100,135 Datasheet, NXP Semiconductors/Freescale Semiconductor, Inc. Distributor | |
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