Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-CAV25128YE-GT3 | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Standard Package | 3,000 | |
Category | Integrated Circuits (ICs) | |
Family | Memory | |
Series | Automotive, AEC-Q100 | |
Packaging | Tape & Reel (TR) | |
Format - Memory | EEPROMs - Serial | |
Memory Type | EEPROM | |
Memory Size | 128K (16K x 8) | |
Speed | 10MHz | |
Interface | SPI Serial | |
Voltage - Supply | 2.5 V ~ 5.5 V | |
Operating Temperature | -40°C ~ 125°C | |
Package / Case | 8-TSSOP (0.173", 4.40mm Width) | |
Supplier Device Package | 8-TSSOP | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | CAV25128YE-GT3 | |
Related Links | CAV2512, CAV25128YE-GT3 Datasheet, ON Semiconductor Distributor |
![]() | PG1111R-TR | LED GREEN DIFFUSED 1206 SMD | datasheet.pdf | |
![]() | RG3216N-2430-B-T5 | RES SMD 243 OHM 0.1% 1/4W 1206 | datasheet.pdf | |
![]() | RMC26DRTN | CONN EDGECARD 52POS DIP .100 SLD | datasheet.pdf | |
![]() | MCP23018-E/SP | IC I/O EXPANDER I2C 16B 28SDIP | datasheet.pdf | |
![]() | ERA-2AEB1331X | RES SMD 1.33KOHM 0.1% 1/16W 0402 | datasheet.pdf | |
![]() | 961123-5500-AR-PT | CONN HEADER R/A 23POS GOLD SMD | datasheet.pdf | |
![]() | RWR78S6R98FMRSL | RES 6.98 OHM 10W 1% WW AXIAL | datasheet.pdf | |
![]() | ATS-08D-121-C3-R0 | HEATSINK 50X50X10MM XCUT T412 | datasheet.pdf | |
![]() | ATS-18E-104-C1-R1 | HEATSINK 40X40X12.7MM XCUT | datasheet.pdf | |
![]() | MLG0402Q2N4BT000 | FIXED IND 2.4NH 200MA 800 MOHM | datasheet.pdf | |
![]() | IEG666-1-61-50.0-01-V | CIR BRKR MAG-HYDR LEVER 50A | datasheet.pdf | |
![]() | XCV600E-6GB432I | IC FPGA 316 I/O 432MBGA | datasheet.pdf |