Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-CBT3125D,118 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | Logic Packages | |
| Standard Package | 2,500 | |
| Category | Integrated Circuits (ICs) | |
| Family | Logic - Signal Switches, Multiplexers, Decoders | |
| Series | 74CBT | |
| Packaging | Tape & Reel (TR) | |
| Type | FET Bus Switch | |
| Circuit | 1 x 1:1 | |
| Independent Circuits | 4 | |
| Current - Output High, Low | - | |
| Voltage Supply Source | Single Supply | |
| Voltage - Supply | 4.5 V ~ 5.5 V | |
| Operating Temperature | -40°C ~ 85°C | |
| Mounting Type | Surface Mount | |
| Package / Case | 14-SOIC (0.154", 3.90mm Width) | |
| Supplier Device Package | 14-SO | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | CBT3125D,118 | |
| Related Links | CBT312, CBT3125D,118 Datasheet, NXP Semiconductors/Freescale Semiconductor, Inc. Distributor | |
![]() | H4BBT-10104-V8 | JUMPER-H9992TR/1852VI/H9992TR 4" | datasheet.pdf | |
| X9317WV8I-2.7T2 | IC XDCP SGL 100TAP 10K 8-TSSOP | datasheet.pdf | ||
![]() | AMM08DRUN | CONN EDGECARD 16POS .156 DIP SLD | datasheet.pdf | |
![]() | 160457-3 | Connector Quick Connect Tab 14-18 AWG 0.250" (6.35mm) Crimp | datasheet.pdf | |
![]() | KPSE08B12-10S | CONN PLUG 10POS CBL MNT W/SKTS | datasheet.pdf | |
![]() | AU02ZC104KA76A | CAP CER 0.1UF 10V X7R 0402 | datasheet.pdf | |
![]() | MI-26L-IX-F4 | CONVERT DC/DC 270VIN 28VOUT 75W | datasheet.pdf | |
![]() | 82340-1680 | TRIM KIT FOR L-SHAPED SYSTEM | datasheet.pdf | |
![]() | ATS-03E-28-C3-R0 | HEATSINK 70X70X15MM XCUT T412 | datasheet.pdf | |
![]() | DDM50PA | DSUB 50 M PCB R/A G ZINC | datasheet.pdf | |
![]() | MS27473T14B15S-CGMSS3 | JT 15C 14#20 1#16 SKT PLUG | datasheet.pdf | |
![]() | LDB312G4005C-300 | Chip Multilayer Hybrid Baluns | datasheet.pdf |