Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-CD75-E2GA681MYGS | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | ||
| Production Status (Lifecycle) | Obsolete / Discontinued | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1,000 | |
| Category | Capacitors | |
| Family | Ceramic Capacitors | |
| Series | CD | |
| Packaging | Bulk | |
| Capacitance | 680pF | |
| Tolerance | ±20% | |
| Voltage - Rated | 250VAC | |
| Temperature Coefficient | B | |
| Mounting Type | Through Hole | |
| Operating Temperature | -25°C ~ 105°C | |
| Applications | Safety | |
| Ratings | X1Y1 | |
| Package / Case | Radial, Disc | |
| Size / Dimension | 0.295" Dia (7.50mm) | |
| Height - Seated (Max) | 0.453" (11.50mm) | |
| Thickness (Max) | - | |
| Lead Spacing | 0.394" (10.00mm) | |
| Features | High Voltage | |
| Lead Style | Straight | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | CD75-E2GA681MYGS | |
| Related Links | CD75-E2G, CD75-E2GA681MYGS Datasheet, TDK Corporation Distributor | |
![]() | X9400WV24I-2.7 | IC DCP QUAD 10K 64TP 24TSSOP | datasheet.pdf | |
![]() | 21050AB | IC PCI-PCI BRIDGE 208QFP | datasheet.pdf | |
![]() | MAX4070ATA+T | IC OPAMP CURR SENSE 100KHZ 8TDFN | datasheet.pdf | |
![]() | DME2S18K | CAP FILM 0.018UF 10% 250VDC RAD | datasheet.pdf | |
![]() | OMAP3525DCUS | IC MPU OMAP-35XX 600MHZ 423FCBGA | datasheet.pdf | |
![]() | RAC40-24SA | CONV AC/DC 40W 24V OUT SNGL T/H | datasheet.pdf | |
![]() | VE-25Z-EX-S | CONVERTER MOD DC/DC 2V 30W | datasheet.pdf | |
![]() | RN55E1012BRSL | RES 10.1K OHM 1/8W .1% AXIAL | datasheet.pdf | |
![]() | GBB60DYRQ | CONN CARD EXTEND .050" 60POS | datasheet.pdf | |
![]() | EBR1225 | BATTERY LITHIUM COIN | datasheet.pdf | |
![]() | UUJ1H102MNQ1MS | CAP ALUM 1000UF 20% 50V SMD | datasheet.pdf | |
![]() | 20020204-C166A02LF | TB PLG SKT STR(PIP) | datasheet.pdf |