Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-CDB4270 | |
Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Design Resources | Development Tool Selector | |
Standard Package | 1 | |
Category | Programmers, Development Systems | |
Family | Evaluation and Demonstration Boards and Kits | |
Series | - | |
Main Purpose | Audio, CODEC | |
Embedded | Yes, FPGA / CPLD | |
Utilized IC / Part | CS4270 | |
Primary Attributes | Stereo, 24-Bit, 192kHz Sample Rate | |
Secondary Attributes | I²S, S/PDIF Inputs and Outputs, Analog Inputs and Outputs, GUI | |
Supplied Contents | Board | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | CDB4270 | |
Related Links | CDB, CDB4270 Datasheet, Cirrus Logic, Inc. Distributor |
![]() | TMS470R1A256PZ-T | IC MCU ARM7 256KB FLASH 100LQFP | datasheet.pdf | |
![]() | BBL-111-G-E | CONN HEADR LOPRO 11POS .100 GOLD | datasheet.pdf | |
![]() | SSW-128-01-S-S | Connector Receptacle 28 Position 0.100" (2.54mm) Gold Through Hole | datasheet.pdf | |
![]() | CRCW25121M07FKTG | RES SMD 1.07M OHM 1% 1W 2512 | datasheet.pdf | |
![]() | 113EPC | PHONE HI-D JACK .25" 2COND PCB | datasheet.pdf | |
![]() | KLKD.100T | FUSE CERAMIC 100MA 600VAC/VDC | datasheet.pdf | |
![]() | TMPM380FYFG | IC MCU 32BIT 256KB FLASH 100LQFP | datasheet.pdf | |
![]() | RNC50J1671BSBSL | RES 1.67K OHM 1/10W .1% AXIAL | datasheet.pdf | |
![]() | CMF554K7000BHBF | RES 4.7K OHM 1/2W .1% AXIAL | datasheet.pdf | |
![]() | ATS-54210K-C3-R1 | HEAT SINK 21X21X14.5MM 3M8810 | datasheet.pdf | |
![]() | TVS07RK-15-97BB | TV 12C 8#20 4#16 SKT J/N RECP | datasheet.pdf | |
![]() | EP2C20 | SECTION IV. I/O STANDARDS IC | datasheet.pdf |