Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-CMF55301K00FHEA70 | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
EDA / CAD Models | Download from Accelerated Designs | |
Standard Package | 5,000 | |
Category | Resistors | |
Family | Through Hole Resistors | |
Series | CMF | |
Packaging | Tape & Reel (TR) | |
Resistance (Ohms) | 301k | |
Tolerance | ±1% | |
Power (Watts) | 0.5W, 1/2W | |
Composition | Metal Film | |
Features | Flame Retardant Coating, Moisture Resistant, Safety | |
Temperature Coefficient | ±50ppm/°C | |
Operating Temperature | -55°C ~ 175°C | |
Package / Case | Axial | |
Supplier Device Package | Axial | |
Size / Dimension | 0.090" Dia x 0.240" L (2.29mm x 6.10mm) | |
Height | - | |
Number of Terminations | 2 | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | CMF55301K00FHEA70 | |
Related Links | CMF55301, CMF55301K00FHEA70 Datasheet, Vishay/Dale Distributor |
![]() | K1050E70 | SIDAC 95-113V 1A TO92 | datasheet.pdf | |
![]() | Q2-3XF-RK1-1/8-01-6IN-24 | HEATSHRINK REFILL PK 1/8"-6" BLK | datasheet.pdf | |
![]() | H3WWH-3006M | IDC CABLE - HPL30H/AE30M/HPL30H | datasheet.pdf | |
![]() | 356611-2 | 10AWG DIE SET FOR 69710-1 | datasheet.pdf | |
![]() | MUSES72320V-TE2 | IC DUAL CHAN VOLUME 32-SSOP | datasheet.pdf | |
![]() | DEM09S343 | D-Sub Connector Receptacle, Female Sockets 9 Position Through Hole Solder | datasheet.pdf | |
![]() | 2151373-2 | OCEAN SIDE FEED APPLICATOR | datasheet.pdf | |
![]() | 70156-4278 | SYSTEM | datasheet.pdf | |
![]() | 416276-002 | PRESS FIT | datasheet.pdf | |
![]() | SBR30A60CTBQ-13 | DIODE ARRAY SBR 60V 15A D2PAK | datasheet.pdf | |
![]() | BFC238663104 | CAP FILM 100 NF 5% 2000VDC RAD | datasheet.pdf | |
![]() | XC4025EPG299-4C | IC FPGA 193 I/O 240QFP | datasheet.pdf |